KLA Tencor P-170: P-17 performance with the HRP-260 wafer handler for cassette-to-cassette stylus profiling of 75–200 mm wafers.
Key features
- Wafer handler
- Loads 75 to 200 mm opaque (e.g. silicon) and transparent (e.g. sapphire) samples automatically.
- Measurement stability
- UltraLite sensor, constant force control and an ultra-flat scanning stage.
- No stitching
- Scans up to 200 mm in one pass.
- Production capability
- Fully automated with sequencing, pattern recognition and SECS/GEM.
Specifications
From KLA Instruments' product page.
| Step height | Nanometres to 1000 µm |
|---|---|
| Stylus force | 0.03 to 50 mg, constant force control |
| Scan length | Up to 200 mm without stitching |
| Wafer handler | Cassette-to-cassette, 75 to 200 mm, opaque and transparent |
| Camera | 5 MP high-resolution colour |
| Stylus tip radius | 40 nm to 50 µm (diamond); included angle 20 to 100° |
Resources
Webinars and videos
From the manufacturer's own channels.
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Webinar · 14 September 2021 · KLA Instruments
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Webinar · 13 April 2021 · KLA Instruments
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Webinar · 22 September 2020 · KLA Instruments
Automated Step Height Metrology for Production Process Monitoring

