IP-10K Ion Beam Polisher

COXEM IP-10K: argon ion beam cross-section and flat milling for SEM, EDS and EBSD, at 1,000 µm/h, with optional cooling and air protection.

Key features

Damage-free cross sections: Argon ion milling avoids the deformation, cracks and contamination of mechanical polishing.
Fast: 1,000 µm/h milling (at 8 kV on a Si wafer).
Flat milling (option): Large, uniformly polished surfaces for SEM and EBSD.
Peltier cooling (option): Down to −25 °C for heat-sensitive samples.
Air protection (option): Air-sensitive samples move from glove box to polisher and SEM without exposure.
Materials: Metals, ceramics and battery components.

IP-10K
Accelerating voltage	2–8 kV
Milling speed	1,000 µm/h (8 kV, Si wafer)
Stage swing angle	±35°
Max sample size	20 × 10 × 5.5 mm (W × L × T); 16 × 10 × 9.5 mm (W × D × H)
Specimen movement	X ±3.5 mm, Y ±2 mm
Operation	7-inch touch panel
Microscope and camera	5×, 10×, 20×, 40× digital microscope; chamber camera with ion-beam observation mode
Gas	Argon (99.999%), 0.03–0.05 MPa, mass flow control
Vacuum	Turbo pump and diaphragm pump
Dimensions	640 × 492 × 282 (465) mm (W × D × H)
Weight	45 kg main system; 6.5 kg diaphragm pump
Options	Flat milling (10–90°); Peltier cooling (−25 to +50 °C); Air-Protection Module

From the manufacturer's own channels.