COXEM IP-8K: argon ion beam cross-section milling for SEM and EDS at 700 µm/h, with optional flat milling.
Key features
- Damage-free cross sections
- Argon ion milling for clean cross sections without mechanical polishing artefacts.
- 700 µm/h
- Milling speed at 8 kV on a Si wafer.
- Flat milling (option)
- Large-area surface finishing for SEM and EBSD.
- Same platform as IP-10K
- Touch panel, digital microscope and chamber camera; cooling and air protection are IP-10K options only.
Specifications
From COXEM's product page.
| Accelerating voltage | 2–8 kV |
|---|---|
| Milling speed | 700 µm/h (8 kV, Si wafer) |
| Stage swing angle | ±35° |
| Max sample size | 20 × 10 × 5.5 mm (W × L × T); 16 × 10 × 9.5 mm (W × D × H) |
| Specimen movement | X ±3.5 mm, Y ±2 mm |
| Operation | 7-inch touch panel |
| Gas | Argon (99.999%), 0.03–0.05 MPa, mass flow control |
| Vacuum | Turbo pump and diaphragm pump |
| Dimensions | 640 × 492 × 282 (465) mm (W × D × H) |
| Weight | 45 kg main system; 6.5 kg diaphragm pump |
| Options | Flat milling (10–90°) |
Resources
Webinars and videos
From the manufacturer's own channels.





