Zeta-388 Optical Profiler

KLA Zeta-388: the Zeta-300 with a cassette-to-cassette wafer handler for fully automated 3D optical metrology of 100 to 200 mm wafers.

Key features

ZDot: Collects a high-resolution 3D scan and a True Color infinite-focus image at the same time.
Interferometry (ZI): Phase and vertical scanning interferometry (PSI and VSI) for wide-area measurements with high Z resolution.
Film thickness (ZFT): Integrated broadband reflectometer for transparent single- and multi-layer films.
Defect inspection and review: Automated optical inspection, and KLARF files to drive the stage to defects for 3D review.
Production capability: Fully automated measurements with sequencing and pattern recognition.
Interference contrast (ZIC): Nomarski interference contrast for surfaces with sub-nanometre roughness.
Wafer handler: Cassette-to-cassette loading of opaque (e.g. silicon) and transparent (e.g. sapphire) wafers, 100 to 200 mm.

Measurement
Step height	Nanometres to millimetres
Transparent film thickness (ZFT)	30 nm to 100 µm
Transparent film thickness (ZDot)	Films thicker than 10 µm
Defect inspection	Defects larger than 1 µm
Stress	2D thin-film stress

Automation and isolation
Wafer handler	Cassette-to-cassette, 100 to 200 mm, opaque and transparent wafers
Chucks	100 to 200 mm, including chucks for bowed wafers; backlight chucks for transparent substrates
Isolation	Passive isolation built into the base; active isolation table optional
Acoustic enclosure	Standard

Optics and standards
Objectives	2.5× to 150×, plus long and ultra-long working distance objectives
Optical couplers	1×, 0.35×, 0.5× or 0.63×
Step height standards	8 nm to 250 µm (VLSI Standards, NIST traceable)

From the manufacturer's own channels.