Skip to content
PIE Scientific Tergeo-Plus plasma cleaner and asher
Photos: PIE Scientific

Tergeo-Plus Plasma Cleaner

PIE Scientific Tergeo-Plus: a tabletop plasma cleaner, etcher and asher with a larger chamber for a 4-inch wafer boat plus a 6-inch wafer.

Key features

Larger chamber
Holds a 4-inch wafer boat plus one 6-inch wafer.
Two plasma sources
Direct and remote (downstream), each with its own plasma strength sensor.
Pulsed plasma
Duty cycle from 100% down to below 1%.
High-purity quartz
Quartz tube and 2 mm quartz sample holder; external electrodes reduce metal sputtering.
Recipes
20 recipes and job sequences of up to three steps.

Specifications

From PIE Scientific's product page.

Tergeo-Plus
Chamber 160 mm ID (170 mm OD) × 280 mm deep
RF power options 150 W, 300 W or 500 W, 1 W steps
RF frequency 13.56 MHz, automatic impedance matching
Plasma modes Direct (capacitively coupled) and downstream; continuous or pulsed, duty cycle 100% to below 1%
Gas inputs Up to 3 mass flow controllers, plus a vent port
Gas flow 0–100 sccm per MFC; ¼-inch Swagelok
Display 7-inch touchscreen
Power 110–230 V AC
Pump requirement NW/KF25 port; ≥ 2.0 cfm; ≤ 50 mTorr

Resources

Applications