Scribing and Cleaving Kit

A$ 450A$ 520

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

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Description

The complete tool set to scribe and cleave cleanly. This is a critical step to getting the best cross-sections. The kit includes two diamond scribes for marking and scribing, one pen style diamond scribe and pliers for cleaving, pliers for cleaving. This kit wide is suitable for a wide variety of substrates and wafers (Si, GaAs, glass).

The standard configuration includes one each:

1.       Diamond Scribe-Pen style

2.       Diamond Scribe-straight tip

3.       Diamond Scribe- 30 degree tip

4.       Tweezers with black soft fiber fine tip (length 6 ¼”)

5.       CleanBreak Pliers-Wafer cleaving pliers.

6.       Small ruler mat-Self healing, Small wafer piece ruler mat

7.       Clear plastic ruler with metric and US units

8.       Tungsten cleaving wire

Additional information

Model

Without mat, With mat