Automated High Resolution Stylus Profilers

KLA Instruments’ HRP-series high resolution stylus profilometers deliver high-precision 2D and 3D surface metrology, measuring step height, surface roughness, bow, stress and other challenging analyses by generating reliable, precise data with industry-leading stability and reliability.

Nano Technology Solutions is the exclusive distributor of KLA Instruments and supplies, installs, supports surface metrology products and accessories across Australia and New Zealand. We have KLA factory-trained engineers on these metrology products and can guide you on the right configuration suitable for your research needs.

Contact us to discuss your specific requirements and applications.

The HRP-260 system is a high-resolution, cassette-to-cassette stylus profiler, offering production proven performance with automated wafer handling capability. It employs the advanced LVDC sensor technology which enables precise, stable, high resolution measurements. It can measure features up to 1mm in height or depth while enabling high Z resolution capability that delivers 0.001Å z resolution in the lowest vertical range (1μm step) and 0.60Å z resolution in the highest vertical range (1000μm step). It also has a fast linear response to accurately track changes in surface topography and provides closed loop software control to ensure a constant force is applied on the sample surface, making it ideal for measurements with strict force requirements. Apart from these, it also has the following features for high-throughput production requirements: 

• Dual-stage capability that delivers full wafer scanning up to 200 mm without the need for stitching, plus a high-resolution piezoelectric scanning stage to measure small features at higher resolution.
• 2D and 3D measurements of topography, with a variety of filtering, levelling, and data analysis algorithms to quantify surface topography.
• Fully automated, material-independent measurements achieved through automated wafer handling, pattern recognition, sequencing, feature detection, and feature finding. 
• Fast and easy recipe setup with point-and-click stage controls, low and high magnification optics, and high resolution digital cameras.

Advanced geometric pattern recognition algorithms and calibrations for X-Y and Z matching enhance recipe transportability between systems, a key requirement for a 24×7 production environment.

Applications

• High resolution 2D and 3D scanning of surface topography
• Step heights from nanometres to 327 μm, used to quantify the material deposited or removed during etch, sputter, deposition, spin coating, CMP, and other processes.
• Measurement of 2D and 3D surface texture, roughness, and waviness.
• Measurement of 2D and 3D shape or bow of a surface, including wafer bow resulting from layer stress mismatch during the device fabrication process, such as deposition of multiple layers in the production of semiconductor or compound semiconductor devices.
• Measurement of thin-film stress induced during the manufacture of semiconductor devices having multiple process layers, using Stoney’s equation.
• Defect characterisation: The HRP supports the KLARF file format that contains defect location coordinates generated by a defect inspection tool, such as the Candela® 8520. Large defects are used to align defect coordinates between tools, enabling automatic navigation to specific defects. Feature Detection automatically measures up to 30 steps in a single scan.

The HRP-260 is useful for high-throughput production in multiple industries:

• LED and Power Devices:
  • Measure step heights for patterning processes, including MESA step height, ITO step height, and contact depth.
    
  • Measure substrate roll off, bow, epitaxial roughness, and epitaxial thin-film stress that can lead to cracks and defects.
  • Use the Defect Review application to distinguish between a nuisance or a killer defect.

• MEMS and Optical Electronics:
  • Measure step height, radius of curvature, and 3D topography for macro and micro lenses.
  • Measure etch depth and surface roughness for waveguides and dense wavelength division multiplexing (DWDM) structures.

• Data Storage:
  • Characterise thin film head wafers and sliders, hard disks, and optical and magnetic media.
  • Wafer applications include plating thickness, coil heights, and CMP planarity.
  • Slider applications include pole-tip recession analysis, air bearing cavity measurement, and laser texture bump characterisation that includes bump height, width, and depth analysis.

For general information on the Hardware and Software features of HRP-Series Profilers, click here. Apart from these, the HRP systems also have the following specific hardware features:

• High Resolution Stage: A piezoelectric stage that has a 90 x 90 μm scan range with 1nm resolution provides capability similar to an AFM. Combined with Feature Find, the stage can be used to precisely locate the feature of interest, enabling rapid measurement of sub-micron features for use in a production environment. High-resolution 3D scanning also enables measurement of the impact of changes in process parameters, new layer development, or quantifying the topography of defects when combined with the Defect Review software.
• Sample Chucks and Handler Options: The HRP-260 system has a range of chucks and handler options available to support multiple applications. The standard is a vacuum chuck with support for measuring samples from 75 to 200 mm, with an opaque wafer aligner and cassette stations for 200 mm wafers. A stress chuck is available with 3-point locators to support the sample in a neutral position for accurate bow measurements. Options include bowed wafer sample handling, transparent sample alignment (e.g., sapphire), smaller sample sizes ranging from 75mm to 150mm, a second cassette station, a cassette slot mapper, a signal tower, and an ioniser.
• Step Height Standards: The HRP-260 system uses thin and thick film NIST-traceable step height standards offered by VLSI Standards. The standards feature an oxide step on a 200mm Si wafer. Available step height standards range from 8nm to 100 μm.
• Upgrade to HRP-260 Stylus Profiler: The HRP®-240 and HRP®-250 systems can be upgraded to HRP®-260. The upgrade includes profiler software with algorithms that significantly improve pattern recognition performance and recipe transportability between tools.